Electroplated copper thin films have become indispensable for the interconnections in next-generation semiconductor devices because of its low electric resistivity and high thermal conductivity.
Publication type:Research Problem
Published:
Language:English
Licence:
CC BY 4.0
Peer Reviews (This Version): (0)
Red flags:
(0)
Actions
Download:
Sign in for more actionsSections
Research topics above this in the hierarchy
Funders
No sources of funding have been specified for this Research Problem.
Conflict of interest
This Research Problem does not have any specified conflicts of interest.