layer deposition
Research Topic
Language: English
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Research problems linked to this topic
- Residual stress-induced deformations are a major cause of tolerance loss in solid freeform fabrication process employing direct metal deposition.
- Water droplet erosion damage is due to the high speed impingement of several hundred micron-sized water droplets on solid surfaces.
- Solution-based deposition techniques are emerging as an efficient route for low-cost photovoltaics (PV).
- Physical vapor deposition (PVD) coated surfaces are often subjected to repetitive impact loads.
- Atomic layer deposition (ALD) has emerged as a critical technique to deposit highly conformal and uniform thin films for advanced semiconductor devices.
- Thin film vapor deposition processes, e.g., chemical vapor deposition, are widely used in high-volume manufacturing of electronic and optoelectronic devices.
- Silicon dioxide films deposited by plasma-enhanced chemical vapor deposition (PECVD) are useful as interlayer dielectric for metal-insulator structures such as MOS integrated circuits and multichip modules.
- Solution of the problem of laminar film condensation with both a gravitational type body force and a moving vapor cocurrent and parallel to the surface is presented in this paper.
- Barrier films are commonly deposited onto flexible substrates by atomic layer deposition (ALD) to protect organic electronics from degradation due to the ingress of moisture.
- Direct liquid-phase exfoliation of layered materials by means of ultrasound, shear forces or electrochemical intercalation holds enormous promise as a convenient, cost-effective approach to the mass production of two-dimensional (2D) materials, particularly in the form of colloidal suspensions of high quality and micrometer- and submicrometer-sized flakes.
- The mechanism of droplet drying is a widely concerned fundamental issue since controlling the deposition morphology of droplet has significant influence on printing, biology pattern, self-assembling and other solution-based devices fabrication.
- high density/low resistivity TaN film grown using ion-induced atomic layer deposition (iALD) has been developed as the metal barrier for nano-scale Cu interconnects.
- Optimized coating adhesion and strength are the advantages of high-power impulse magnetron sputtering (HiPIMS) as an innovative physical vapor deposition (PVD) process.