microelectronics
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- The relation between the heterogeneous microstructure of biological tissues and their measurable scattering properties is still poorly understood.
- There has been a strong demand for developing an ultradense and low-power nonvolatile memory technology.
- Heterogeneous integration in microelectronic systems using interposer technology has attracted significant research attention in the past few years.
- The implantable microsystems are conventionally powered using batteries that have limited life-span and bio-compatibility issues.
- RF microelectromechanical (MEMS) switches are usually limited in term of power handling.
- MicroElectroMechanical Systems (MEMS) technology offers considerable potential throughout the manufacturing sector, because of certain intrinsic advantages in terms of low cost, reliability, and small size.
- The thin film materials with small volume and high reliability have become an integral part of microelectromechanical systems and have a wide range of applications in national defense, aerospace, communication, automobile manufacturing, and other fields.
- Hollow inorganic microstructures have gained much interest in nowadays research fields as they offer unique properties (high specific area, thermal conductivity or density) when compared to their bulk equivalents 1.
- Although silicon planar technology has generated the field of micromechanics, it has been realized that this technology has intrinsic limitations for the fabrication of truly so micromechanisms.
- This paper presents some of the problems and trends associated with silicon and germanium x-ray detectors for microanalysis as seen from the manufacturer's point of view.
- Resistive switching memory (RRAM) devices are receiving considerable interest as future-generation high-density storage technology or possible enablers of storage class memory.
- Although steels have been extensively studied, the application of traditional characterization methods to investigate the microstructure still poses significant challenges.
- Deep reactive ion etching (DRIE) technology is one of the most important technologies in the processing of microelectronic devices and microelectromechanical system.
- Due to good chemical, electrical and mechanical properties, Low Temperature Co-Fired Ceramic (LTCC) and Polydimethylsiloxane (PDMS) has shown great potential in microelectronic applications.
- Gated vacuum microelectronic devices have m y promising applications including flat-panel displays and microwave components, but their acceptance has becm limited by the susceptibility of the emitters to failure.