semiconductor material
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- With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention.
- Basic electronic properties of semiconductors are extremely sensitive to defects and impurities.
- Plasma processing induced damage of thin gate oxide is a major concern for device integrity in etch or thin film module process development.
- Implantation and a subsequent annealing at high temperature are required for fabricating a high voltage Schottky Barrier Diode (SBD) with a field limiting ring (FLR) or a junction termination extension (JTE), but high temperature annealing degrades surface condition of a SiC substrate and induces a degradation of electronic characteristics of a fabricated SBD.
- The Embedded die in substrate (EDS) market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by smaller form factor, better heat dissipating, low noise emission, higher levels of integration and better performance.
- Gold plated films are used in switches and connectors in the electronics industry due to high stability and high conductivity, for which nickel plated film is used as an undercoat.