interconnection
Research Topic
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Research problems linked to this topic
- For the future advanced applications in consumer electronic products, the need of flexible interconnects increases rapidly.
- The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities.
- Flexible interconnects with superconducting (SC) traces and polyimide dielectric can provide low signal loss and low thermal conductivity at cryogenic temperatures, and are expected to find use in densely integrated cryogenic electronics systems.
- There is growing interest in Cu wire bonding for IC (Integrated Circuit) interconnection due to lowered the cost, better the electrical performance and mechanical properties to against the mold flow.